General Information

Req #
WD00027599
Career area:
Research/Development
Country/Region:
China
State:
Beijing
City:
北京（Beijing）
Date:
Thursday, April 21, 2022
Working time:
Full-time
Additional Locations: 
* 北京（Beijing） - Beijing - China

Why Work at Lenovo

Here at Lenovo, we believe in smarter technology that builds a brighter, more sustainable and inclusive future for our customers, colleagues, communities, and the planet.

And we go big. No, not big—huge.

We’re not just a US$70 billion revenue Fortune Global 500 company, we’re one of Fortune’s Most Admired. We’re transforming the world through intelligent transformation, offering the world’s most complete portfolio of smart devices, infrastructure, and solutions. With more than 71,500 employees doing business in 180 markets, we help millions—not just the select few—experience our version of a smarter future.

The one thing that’s missing? Well… you...

Description and Requirements

岗位职责：

1. 负责基带处理板、GPU板卡、CPU主板等硬件的方案选型、架构设计和硬件设计；
2. 负责组织协调电源、结构、散热、EMC以及安全性的设计工作；
3. 负责整机或单板的调试和测试；
4. 负责硬件生产各环节的技术沟通工作。

任职要求：

1. 电子工程、自动控制、通信工程等相关专业本科以上学历，硕士优先； 

2. 精通高速数字电路、时钟以及电源的设计，熟悉常用的高速电路的硬件接口规范； 
3. 熟练使用原理图和PCB工具软件； 
4. 具有5年以上信息与通信产品的整机或单板的硬件研发经验，如：4G/5G基站硬件、交换机、服务器、高速数据采集卡、GPU卡等相关产品。 
5. 熟悉通信设备的机箱或板卡的散热和EMC设计，有通信设备的可靠性、散热、电磁兼容性、安全性等测试经验者优先。 
6. 良好的英文资料阅读能力，良好的沟通能力和团队合作精神。

TO BE DELETED - Multiple Cities (OLD)
* 北京（Beijing） - Beijing - China
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