General Information

Req #
100014205
Career area:
Hardware Engineering
Country/Region:
China
State:
Tianjin
City:
天津（Tianjin）
Date:
Friday, July 22, 2022
Additional Locations: 
* 天津（Tianjin） - Tianjin - China

Why Work at Lenovo

Here at Lenovo, we believe in smarter technology for all, so we spend our time building a society that’s brighter and more inclusive. 

And we go big. No, not big—huge.

We’re not just a Fortune 500 company, we’re one of Fortune’s Most Admired. We’re in 180 countries, working with 63,000 brilliant colleagues and counting. And we’re known for the world’s most complete portfolio of smart technology, from devices to software to infrastructure.

With our ingenuity, we help millions—not just the select few—experience our version of a smarter future. 

The one thing that’s missing? Well… you...

Description and Requirements

Request：
1.Researching on new X86 (AMD) platform technology;
2.Co-work with SI, EA, DC-DC and layout to deliver M/B or subcard design
3.Rack server motherboard and sub card schematics design and layout review, new test cases creation, hardware testing, problem fix, cost management, manufacture support
4.Hardware test and validation for low speed signal on M/B or subcard
Requirements:
1.Debug skills for system level & EE related issues.
2.Familiar with SMT/box build process to support pilot run and production build and FA;.
3.Familiar with Server Architecture and related Key parts
4.Written and verbal communication skills in Business English
5.Experience of logic and/or board design of electronic devices
6.Experience of X86 platform design
7.Familiar with High Speed protocol ( PCIE, USB, SAS…)
8.Familiar with Server system design related knowledge ( ME, Thermal, EMC, Safety…)
9.Experience of leading project / management
10.Familiar with engineering change management process to support post production ECR

* 天津（Tianjin） - Tianjin - China
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