General Information

Req #
Career area:
Monday, April 11, 2022
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Why Work at Lenovo

Here at Lenovo, we believe in smarter technology that builds a brighter, more sustainable and inclusive future for our customers, colleagues, communities, and the planet.

And we go big. No, not big—huge.

We’re not just a US$70 billion revenue Fortune Global 500 company, we’re one of Fortune’s Most Admired. We’re transforming the world through intelligent transformation, offering the world’s most complete portfolio of smart devices, infrastructure, and solutions. With more than 71,500 employees doing business in 180 markets, we help millions—not just the select few—experience our version of a smarter future.

The one thing that’s missing? Well… you...

Description and Requirements

Position Description

1.      Be responsible for after-sales baseband related EWG (Early Warning Group) analysiscommon failures like no turn on/no charging/cycling/crash… and output overall analysis report by product to align with HW of Inhouse/ODM.

2.      Be responsible on the failure analysis, mostly PCBA related. Stream-line RD team, and discuss for corrective action, tracking for implementation as well.

3.      Be responsible for Issue Fupan and quality performance improvement. Be a part to review on updating of design rule and testing criterion.

4.      Be responsible for overall schedule of EWG samples analysis. Make a full use of current resource to achieve greatest efficiency.

5.      Be responsible for EWG lab capability enhancement and FA skill improvement. For the top difficult issue, need moving fast to set-up specific project.

6.      Be responsible for EWG lab daily affairs, like maintenance of equipment, and training.

Position Requirement

1.      BS in Electrical Engineer, Communication Engineering, or related. Master’s degree is preferred. Minimum of 5 years’ experience in Hardware BB development. Failure analysis on after-sales experience is a plus.

2.      Solid knowledge of analog and digital electronics. Familiar with the principle and application of hardware modules. Professional on Cadence, Allegro and other related software.  Oscilloscope and other testing instruments are required to be very familiar.

3.      Proficient in smartphone hardware circuit architecture and failure analysis, such as power supply, charging, sensor, audio, electrostatic protection, storage, etc.

4.      Experienced in smartphone development on Qualcomm, MTK and Unisoc platforms, and familiar with principles of baseband electronic components, also familiar with mobile phone hardware development process.  

5.      Excellent logical and data analysis capability.

6.      Excellent communication and collaboration skill.

7.      Oral and written capability in English and able to communicate with overseas colleagues.