General Information

Req #
WD00008084
Career area:
Hardware Engineering
Country/Region:
China
State:
Beijing
City:
北京(Beijing)
Date:
Friday, August 13, 2021
Working time:
Full-time

Why Work at Lenovo

Here at Lenovo, we believe in smarter technology for all, so we spend our time building a society that’s brighter and more inclusive. 

And we go big. No, not big—huge.

We’re not just a Fortune Global 500 company, we’re one of Fortune’s Most Admired. We’re in 180 markets, working with 63,000 brilliant colleagues and counting. And we’re known for the world’s most complete portfolio of smart technology, from devices to software to infrastructure.

With our ingenuity, we help millions—not just the select few—experience our version of a smarter future. 

The one thing that’s missing? Well… you...

Description and Requirements

Position Description:

1.       Notebook concept thermal design, assessment, solution optimization, and verification. 

2.       Notebook system thermal design & development: thermal fan/ thermal module/ thermal material. 

3.       Innovation work: system thermal solution, new thermal fan, thermal part & thermal technology 

4.       Thermal & acoustic verification & test. 

5.       Identify supplier capabilities and align with cross team.

Position Requirements:

1.       Mechanical & thermal related background

2.       Familiar with notebook or tablet system thermal design, and development process

3.       Flotherm, icepak, and fluent simulation capability

4.       Have experience for fan, thermal module design, heat pipe or vapor chamber design and manufacture

5.       Capability for thermal test & acoustic test

6.       3~5 years work experience


We are an Equal Opportunity Employer and do not discriminate against any employee or applicant for employment because of race, color, sex, age, religion, sexual orientation, gender identity, status as a veteran, and basis of disability or any federal, state, or local protected class.