General Information

Req #
WD00036606
Career area:
Hardware Engineering
Country/Region:
China
State:
Guangdong
City:
深圳(Shenzhen)
Date:
Friday, July 22, 2022
Working time:
Full-time
Additional Locations: 
* 深圳(Shenzhen) - Guangdong - China

Why Work at Lenovo

Here at Lenovo, we believe in smarter technology that builds a brighter, more sustainable and inclusive future for our customers, colleagues, communities, and the planet.

And we go big. No, not big—huge.

We’re not just a US$70 billion revenue Fortune Global 500 company, we’re one of Fortune’s Most Admired. We’re transforming the world through intelligent transformation, offering the world’s most complete portfolio of smart devices, infrastructure, and solutions. With more than 71,500 employees doing business in 180 markets, we help millions—not just the select few—experience our version of a smarter future.

The one thing that’s missing? Well… you...

Description and Requirements

1.负责智能设备软件架构和方案的设计,可行性研究, 前期技术预研及核心技术突破
2.组织和指导团队开展BSP及应用软件的研发,并参与解决项目开发过程中的技术难点;
3.组织和指导团队开展软件的优化及软硬件优化;并配合其他团队,如EE、测试等过程中特殊版软件或工程模式提供支撑方案;
4.针对客户的具体设计要求提出解决方案和合理建议;
5.参与项目的制定和执行。

任职要求:
1. 本科或以上学历;
2. 深入理解Android/Linux 内核/RTOS 等,并具备 9 年以上基于Linux/Android的BSP开发经验
3. 深入理解CPU(ARM/RISC V/x86)架构,保护模式/MMU/DMA/Cache
4. 熟悉主流的SoC,如高通,MTK,Rockchip,ST,芯驰等方案,有良好硬件基础,能够理解硬件电路原理,能操作示波器,逻辑分析仪;
5. 熟悉PCIe/DP/MIPI/USB/SSD/SPI/I2C等设备驱动和总线至少三种以上;
6. 具有BSP和软件项目管理和团队管理能力
7. 良好的沟通表达能力和团队协作精神,良好的英语读写能力;

* 深圳(Shenzhen) - Guangdong - China