General Information

Req #
WD00030466
Career area:
Hardware Engineering
Country/Region:
China
State:
Shanghai
City:
上海(Shanghai)
Date:
Monday, June 6, 2022
Working time:
Full-time
Additional Locations: 
* 上海(Shanghai) - Shanghai - China

Why Work at Lenovo

Here at Lenovo, we believe in smarter technology that builds a brighter, more sustainable and inclusive future for our customers, colleagues, communities, and the planet.

And we go big. No, not big—huge.

We’re not just a US$70 billion revenue Fortune Global 500 company, we’re one of Fortune’s Most Admired. We’re transforming the world through intelligent transformation, offering the world’s most complete portfolio of smart devices, infrastructure, and solutions. With more than 71,500 employees doing business in 180 markets, we help millions—not just the select few—experience our version of a smarter future.

The one thing that’s missing? Well… you...

Description and Requirements

工作内容:

1. 深度参与芯片的Domain Specific Architecture设计,与算法、软件、工具链、架构团队一起软硬件融合、协同设计,定义并完成芯片的微架构和详细设计规格;

2.负责芯片前端设计工作,包括模块RTL设计,子系统数据流分析和梳理,时钟复位设计,低功耗设计,NOC总线,SDC,UPF,SOC集成和综合实现等; 

3.负责模块/子系统的性能、功耗、面积评估和优化; 

4.深度参与SOC模块级和系统级验证; 

5.深度参与芯片后端迭代,进行性能分析、功耗分析等; 

6.深度参与芯片验证、后仿、底层软件开发联调以及芯片回片测试和量产导入等相关工作;1.计算机体系架构,微电子,电子,通信或其他相关专业背景;有3年以上的SOC芯片设计经验;

工作内容:

1.有完整的SoC设计开发流程及成功流片经验,尤其是有先进工艺下大型高算力芯片成功量产的经验;

2.熟悉视频/DSP/PCIe/SoC互连和NoC等,一个或者多个领域;

3.对时序、功耗、面积优化有很强的理解;

4.具有使用C++/python进行性能仿真和建模的经验;

5.有DDR/PCIe/USB/Ethernet/UFS/SDIO协议及有相关集成设计经验者尤佳;

6.有AI,NOC,ARM,GPU,ISP,DSP,Computer Vision,Multi-Media等IP的集成和设计经验者优先。

* 上海(Shanghai) - Shanghai - China