General Information

Req #
WD00013074
Career area:
Hardware Engineering
Country/Region:
China
State:
Hubei
City:
武汉(Wuhan)
Date:
Monday, November 1, 2021
Working time:
Full-time

Why Work at Lenovo

Here at Lenovo, we believe in smarter technology for all, so we spend our time building a society that’s brighter and more inclusive. And we go big. No, not big—huge. 

We’re a US$60 billion revenue Fortune Global 500 company serving customers in 180 markets around the world. Focused on a bold vision to deliver smarter technology for all, we are developing world-changing technologies that power (through devices and infrastructure) and empower (through solutions, services and software) millions of customers every day and together create a more inclusive, trustworthy and sustainable digital society for everyone, everywhere. 

The one thing that’s missing? Well… you...

Description and Requirements

岗位描述:
1   负责智能设备BSP部门产品关键模块需求分析、系统设计、编码实现、系统测试、bug fix以及性能优化等方面的工作   
2   能组织协调公司内部团队和外部团队解决产品该模块开发过程中的关键问题 
3   具有独立分析解决问题的能力和创新思维 

岗位要求: 
1  计算机科学、信息科学、电子工程等相关专业统招本科以上学历 
2  精通Android系统架构,在Android/Linux Kernel驱动等一个或多个领域五年以上的工作经验,有驱动外设模块开发经验者佳(如: SD/LCD/TP/USB/EMMC/PMU/Sensors/WIFI/BT/GPS等中一个或多个模块); 
3  熟悉Linux内核工作机制,能处理Kernel中碰到的常见问题,在嵌入式Linux设备的系统BSP开发方面有丰富的经验 
4  能够准确定位之上某一模块领域内的关键问题
5  有较强的中英文双语沟通交流能力,具备较强协调的技能