General Information

Req #
WD00074002
Career area:
Hardware Engineering
Country/Region:
Taiwan
State:
Taipei City
City:
中山（Zhongshan）
Date:
Thursday, October 31, 2024
Working time:
Full-time
Additional Locations: 
* Taiwan - Taipei City

Why Work at Lenovo

We are Lenovo. We do what we say. We own what we do. We WOW our customers. 

Lenovo is a US$57 billion revenue global technology powerhouse, ranked #248 in the Fortune Global 500, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver Smarter Technology for All, Lenovo has built on its success as the world’s largest PC company with a full-stack portfolio of AI-enabled, AI-ready, and AI-optimized devices (PCs, workstations, smartphones, tablets), infrastructure (server, storage, edge, high performance computing and software defined infrastructure), software, solutions, and services. Lenovo’s continued investment in world-changing innovation is building a more equitable, trustworthy, and smarter future for everyone, everywhere. Lenovo is listed on the Hong Kong stock exchange under Lenovo Group Limited (HKSE: 992) (ADR: LNVGY). 

This transformation together with Lenovo’s world-changing innovation is building a more inclusive, trustworthy, and smarter future for everyone, everywhere. To find out more visit www.lenovo.com, and read about the latest news via our StoryHub.

Description and Requirements

■About Organization

-Yokohama development team is leading development of ThinkPad products. The department of this open recruitment is taking charge of mechanical design for system integration and cooling mainly.

■Roles and responsibilities

-Lead mechanical design for PC system overall, integration and cooling.

-Handle product execution work

-Collaboration with ME/ID/EE team for system integrated thermal design

-Develop thermal design to achieve good cooling performance and UX (Skin temperature, FAN noise).

-Mechanical design for thermal parts by 3D CAD

-FAN, Heatsink, Heat pipe, Vapor chamber, Graphite sheet

-Mockup creation / evaluation

-Ensure cooling capability for TDP requirement

-Overseas Thermal supplier management for design and quality

-Communication with ODM team

-End-to-end development

PoC > NPI > MP > Care for customer voice > Feedback to next generation

■Key Interaction with:

-ThinkPad development team (ID/ME/EE)

-ThinkPad NPI (New product introduction) team

-ThinkPad GCM (Global commodity management) team

-ThinkPad SQE (Suppler quality engineering) team

-ThinkPad PA (Product assurance) team

-Thermal team of Lenovo group (USA, Japan, Taiwan, China)

-SoC vendor

-Cooling device parts supplier

Additional Locations: 
* Taiwan - Taipei City
* Taiwan
* Taiwan - Taipei City
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