General Information

Req #
Career area:
Hardware Engineering
Taipei City
Friday, February 3, 2023
Working time:
Additional Locations
* Taiwan - Taipei City - Taipei

Why Work at Lenovo

Here at Lenovo, we believe in smarter technology that builds a brighter, more sustainable and inclusive future for our customers, colleagues, communities, and the planet.

And we go big. No, not big—huge.

We’re not just a US$70 billion revenue Fortune Global 500 company, we’re one of Fortune’s Most Admired. We’re transforming the world through intelligent transformation, offering the world’s most complete portfolio of smart devices, infrastructure, and solutions. With more than 71,500 employees doing business in 180 markets, we help millions—not just the select few—experience our version of a smarter future.

The one thing that’s missing? Well… you...

Description and Requirements

Lenovo Infrastructure Solutions Group (ISG) is a smart infrastructure solutions provider to organizations of all sizes. We are looking for eager and passionate Campus Hires to join our organization and help us fulfill our mission to be the most trusted data center partner: Empowering customers’ Intelligent Transformation, and solving humanity’s greatest challenges.

These are your detailed responsibilities:

-Provide high-quality thermal solution/proposal to support RFP/RFQs

-Design robust thermal solutions to meet product/customer/ industry specifications;

-Cooperate with the Software team to implement a fan speed control strategy;

-Run system thermal simulation analysis to evaluate thermal feasibility/risk;

-Work with heat sink and fan vendors to manage cost, quality, and functionality;

-Manage system thermal/acoustic test, create test plan, and review test report;

-Root cause analysis of system thermal/acoustic failure;

-Work with cross-function to define system requirements, design products, evaluate design trade-offs, and optimize design performance/risk / cost/manufacturability;

-Main customer contact window for thermal system design ;

-Build and maintain thermal relative process/Spec/SOP.

-New cooling technology tracking;

What you’ll bring/ Position Requirements:

-Electronic product thermal Engineering, the background in thermodynamics, and aerodynamics is a plus;

-Good knowledge of thermodynamics and aerodynamics;

-Familiar with Flotherm or FLOEFD or ICEPAK, or another thermal analysis tool.

-Familiar with fans, heat sinks, heat pipes, Vapor chamber design/selection, liquid cooling, or other advanced cooling technology is a plus

-Familiar with thermal measurement technology and test tools;

-Knowledge about Mechanical design tools, like Creo/AutoCAD;

-Knowledge of server/storage system architecture;

-Familiar with industry standards, including NEBS, ASHRAE etc;

-Project management and cross-function communication skill;

Additional Locations
* Taiwan - Taipei City - Taipei
* Taiwan
* Taiwan - Taipei City
* Taiwan - Taipei City - Taipei