General Information

Req #
100014190
Career area:
Hardware Engineering
Country/Region:
China
State:
Anhui
City:
合肥(Hefei)
Date:
Tuesday, July 19, 2022
Additional Locations: 

Why Work at Lenovo

Here at Lenovo, we believe in smarter technology for all, so we spend our time building a society that’s brighter and more inclusive. 

And we go big. No, not big—huge.

We’re not just a Fortune 500 company, we’re one of Fortune’s Most Admired. We’re in 180 countries, working with 63,000 brilliant colleagues and counting. And we’re known for the world’s most complete portfolio of smart technology, from devices to software to infrastructure.

With our ingenuity, we help millions—not just the select few—experience our version of a smarter future. 

The one thing that’s missing? Well… you...

Description and Requirements

1. 负责IntelAMD平台的笔记本电脑原理图设计
2.
负责DDR 设计,Audio,显卡,TBT 等设计; 协同power 设计人员
3. Platform
方案评估,与机构一起评估DXF ,与thermal 一起评估Thermal Module
4. PCB Layout
布局,布线的检查;指导layout team

5. PCB高速信号仿真,协助layout走线优化
6.
与厂商共同设计符合要求的PCB堆叠; PP 材料选型
7.
BIOSEC ,Driver 等软件人员一起合作解决问题
8.
跟进试产阶段的bug问题,分析并解决之
任职要求:
1
、电子、通信或计算机类相关专业本科及以上学历;
2
、熟悉EDA设计工具Cadence Allegro及其他仿真软件;
3
、英文基础好、能顺畅阅读相关英文技术资料;
4
、熟悉电子产品的开发及相关业务领域的知识;
5
5年以上的X86架构显卡、系统、笔记本电脑和平板电脑硬件开发经验;
6
、具有较强的产品可靠性设计、可维护性/维修性设计能力