General Information

Req #
WD00039383
Career area:
Hardware Engineering
Country/Region:
Taiwan
State:
Taipei City
City:
Taipei
Date:
Friday, February 24, 2023
Working time:
Full-time
Additional Locations: 
* Taiwan - Taipei City - Taipei

Why Work at Lenovo

Here at Lenovo, we believe in smarter technology that builds a brighter, more sustainable and inclusive future for our customers, colleagues, communities, and the planet.

And we go big. No, not big—huge.

We’re not just a US$70 billion revenue Fortune Global 500 company, we’re one of Fortune’s Most Admired. We’re transforming the world through intelligent transformation, offering the world’s most complete portfolio of smart devices, infrastructure, and solutions. With more than 71,500 employees doing business in 180 markets, we help millions—not just the select few—experience our version of a smarter future.

The one thing that’s missing? Well… you...

Description and Requirements

Lenovo Infrastructure Solutions Group (ISG) is a smart infrastructure solutions provider to organizations of all sizes. We are looking for eager and passionate Campus Hires to join our organization and help us fulfill our mission to be the most trusted data center partner: Empowering customers’ Intelligent Transformation, and solving humanity’s greatest challenges.

Lenovo Cloud Service Provider (CSP), We're the only company in the industry with true end-to-end capabilities for tailored CSP solution. We offer design, manufacturing, services and deploy worldwide - all in-house. By providing rapid innovation, best-in-class products, quick delivery, unique time-to-bid cycles, flexible service and support, we’re empowering our customers to accelerate their journey to the cloud, as well as their desire to leverage emerging technology to address specific business opportunities and challenges.

The candidate is expected to work effectively in areas of structure simulation, shock/vibration validation. This person will be responsible for supporting structure development of CSP products.

These are your detailed responsibilities:

  • Capable to evaluate mechanical structure basically by FEA tools, provide design risk assessment report
  • Support validation test includes material preparation, system setup, schedule tracking
  • Support to execute reliability testing via structure equipment (Shock Table, Vibration Table, Package Drop Machine, spectrum analyzer and relative equipment, etc.).
  • Support to deliver mechanical structure analysis reports, with the mitigation solution/plan to fix mechanical structure defects.
  • Gain understanding of packaging design/engineering for CSP products

Organization

You will report to CSP Shock, vibration and package design manager, supporting structure development and analysis of CSP products, also work as part of our global team, to support CSP customers around the world.

What you’ll bring/ Position Requirements:

  • Experience in mechanical design and structure analysis
  • Familiar with FEA tools (Abaqus/ANSYS, LS-Dyna, Hyperworks, etc.)
  • Good technology/product understanding
  • Ability to work in a lab environment.
  • Good communication and presentation skills in English, both written and spoken

What We Will Offer You:

Your experience working for CSP at Lenovo will be exciting, innovating, and challenging.  The CSP commitment to People-First is focused on Employee Experience, Leadership, and One Team, all driving operational excellence and providing you supportive resources to launch your professional career.



Additional Locations: 
* Taiwan - Taipei City - Taipei
* Taiwan
* Taiwan - Taipei City
* Taiwan - Taipei City - Taipei
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