Lenovo

This role is for a PCB Layout engineer in the Lenovo Datacenter Product Group (DCG), based out of Bangalore, Karnataka. This role is core to the Server Development organization in providing the end-to-end design and deliver innovative server designs across DCG.

In this role, you will be working with Hardware Engineers, CMs, and PCB/Assembly vendors to determine PCB stack-up, apply design constraints, perform component placement, and signal routing. You will co-work with hardware and SI/PI engineers to perform signal integrity, power integrity analysis, and release fabrication and assembly packages. This candidate will be an active member of the development team that is highly motivated to engage, understand and solve the technical challenges of today and shape the high-end server designs of tomorrow.

Job Description:

• A bachelor's degree in Electronics Engineering and 8+ years of relevant work experience in PCB design are necessary for this position.

• Proven track record to design & manage all aspects of the high-speed PCB design used in high volume products (like servers, switches, routers, etc).

• Familiarity with PCIe gen 5, UPI, and memory (DDR5) interface routing topologies and constraints..

• Knowledge of other high-speed interfaces like RGMII, SPI, USB, DIMMs (1-SPC & 2-SPC) is a must.

• Hands on experience with Cadence Allegro 21.1 & System Capture are a must.

• Hands on experience in Valor & CAM350 are added advantage.

• It is essential to have a clear understanding of Constraint Manager, CM Settings in the tool, and implementing it on all our server boards.

• It is a requirement to be knowledgeable about HDI technologies like complex stack-ups, different VIA technologies, and back-drilling options.

• Interaction with PCB/PCBA vendors and problem-solving abilities.

• Knowledge in EMC compliance & environmental safety compliance are added advantage. 

• Ability to put in extra hours to meet the deadline including weekends. 

• Good analytical & communication (Verbal/Written) skills. 

Responsibilities:

• Collaborates in developing state-of-the art designs of new or modified, high-density printed circuit boards.

• Leading all aspects of PCB design from requirement definitions & layout completion to fabrication.

• You are responsible for managing and coaching CMs and PCB vendors on a regular basis. 

• Prepare fabrication notes, assembly notes, and all deliverables, such as Gerber files, drill charts, PCB assembly BOMs, 

other PCB and assembly related documents required by PCB fabrication vendors to build a circuit board for prototypes & mass production.

• Having knowledge in understanding data sheets and schematics, creating netlist and constraints, and using schematics as a reference for layout and routing.

• Knowledge and understanding of IPC, JEDEC, IEEE & other electronic standards.

• Experience with HDI design. Skilled in multilayer PCB layout, fabrication, and assembly techniques with the ability to solve problems. 

• Applying extensive PCB design knowledge to solve complex problems.

• Hands on experience with PCB design constraints for Mixed/High Speed/Impedance control designs.

• Experience with PCIe, UPI, RGMII, SPI, USB, Memory interfaces, power distribution & heat dissipation.

• Serves as a technical authority opening the way to innovative PCB solutions.

• Work with Design Engineer & simulation Engineer in making sure PCB layout adhere to SI/PI and EMC requirement.

• Evaluation of existing designs and seeing opportunities for design improvement.

• Support internal / external design team as the need arises. 

• Setting development schedules and accountability for team success.

• Engage in technical discussions within the organization, including DFM/DFA/DFT, industry standards, and meetings, as necessary.