General Information

Req #
WD00061103
Career area:
Hardware Engineering
Country/Region:
India
State:
Karnataka
City:
BANGALORE
Date:
Friday, February 2, 2024
Working time:
Full-time
Additional Locations
* India

Why Work at Lenovo

 We are Lenovo. We do what we say. We own what we do. We WOW our customers. 

Lenovo is a US$62 billion revenue global technology powerhouse, ranked #171 in the Fortune Global 500, employing 77,000 people around the world, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver smarter technology for all, Lenovo has built on its success as the world’s largest PC company by further expanding into growth areas that fuel the advancement of ‘New IT’ technologies (client, edge, cloud, network, and intelligence) including server, storage, mobile, software, solutions, and services. 

This transformation together with Lenovo’s world-changing innovation is building a more inclusive, trustworthy, and smarter future for everyone, everywhere. To find out more visit https://www.lenovo.com, and read about the latest news via our StoryHub. 

Description and Requirements

The position is for a Mechanical Engineer in the Lenovo Infrastructure Solutions Group (ISG), based in Bangalore, Karnataka.  This is an exciting role in the ThinkSystem Server Development organization that has a strong focus to be the #1 trusted IT Partner in the Datacenter market. The pace of technological change in this market is rapid, and our development engineers are constantly challenged to improve the thermal performance and efficiency of our products. Lenovo is looking for an engineer with a strong desire to innovate thermal solutions for our server products.

Basic Requirements:

  • Bachelor’s Degree in Mechanical/Thermal Engineering.
  • 7+ years of in-depth experience in thermal design for Server products OR equivalent products is strongly preferred. 
  • Review server system concepts and market requirements and enable a thermal solution that is compliant with the specifications of the critical components.
  • Ensure that the printed circuit board layouts permit thermal solution placement and adequate airflow / waterflow to cool all components
  • Select fans, heat sinks, and other thermal solution components that are low-cost yet meet all performance requirements
  • Analyze thermal solutions provided to compare with various options and optimize cost vs performance
  • Provide mechanical and thermal review for prototyping boards
  • Document and analyze simulation and test results
  • Write test plans 
  • Conduct thermal tests to qualify the design

Preferred Requirements:

  • Master’s Degree OR research in the relevant field
  • Experience using CFD (Computational Fluid Dynamics) tools to predict operating performance of the server is required.
  • Working knowledge with Creo/Windchill is preferred.
  • Knowledge of air & liquid cooling infrastructure and specifications in the data center is preferred.
  • Current trends of electronics cooling for cloud computing is desired.
  • Modeling and testing skills to validate a design is required. E.g. measuring airflow and temperature on the air bench is required.
  • Data acquisition and ability to organize and summarize results is required.
  • Code skills such as Matlab, Python, or Java to automate data collection and report generation is desired.
  • Knowledge of computer firmware code and algorithms that set operating points, and fault conditions is desired.
  • Knowledge of CAD, material strength, power consumption, and acoustics requirements and the impact of thermal designs on them is desired.

Additional Locations
* India
* India