General Information

Req #
WD00034624
Career area:
Hardware Engineering
Country/Region:
China
State:
Guangdong
City:
深圳(Shenzhen)
Date:
Friday, July 8, 2022
Working time:
Full-time
Additional Locations: 
* 深圳(Shenzhen) - Guangdong - China

Why Work at Lenovo

Here at Lenovo, we believe in smarter technology that builds a brighter, more sustainable and inclusive future for our customers, colleagues, communities, and the planet.

And we go big. No, not big—huge.

We’re not just a US$70 billion revenue Fortune Global 500 company, we’re one of Fortune’s Most Admired. We’re transforming the world through intelligent transformation, offering the world’s most complete portfolio of smart devices, infrastructure, and solutions. With more than 71,500 employees doing business in 180 markets, we help millions—not just the select few—experience our version of a smarter future.

The one thing that’s missing? Well… you...

Description and Requirements

Essential Responsibilities:
  • Work closely with Mechanical teams to drive of ODM.
  • Work with mechanical teams to understand where Lenovo solutions exist and where external solutions are required to drive ODM outcomes.
  • Capable using Finite Element Analysis tools for evaluation independently (Abaqus, LS-Dyna, HyperWorks).
  • Lead projects and initiatives with broad scope and high impact to the business or is a recognized expert in a specialized field.
  • Authoring structure reliability specification, and optimize the operating on time/cost saving.
Qualifications/Requirements:
  • Significant leadership experience in the pakcage industry, including package material development operation.
  • Experience with multiple package development ODM technologies.
  • Experience with multiple aspects of the package supplier chain.
  • Experience with NPI for new requirement introduction.
  • Experience with mechanical structure verification process.
  • Ability to travel 20% of the time.

* 深圳(Shenzhen) - Guangdong - China