Lenovo

Key Responsibilities

Interconnect Solution Development

• Develop and support interconnect solutions for AI servers, GPU, rack-level, and cluster-level platforms.
• Define cable and connector requirements based on system architecture, SI requirements, power delivery, thermal, and mechanical (and manufacturability) constraints.
• Support advanced interconnect applications, including:
  • High-speed copper and optical interconnects
  • Patch panels
  • Optical cable assemblies
  • Cable cartridge solutions
  • Inter-rack DC link high-power connectivity
• Collaborate with SL, EE, SI, ME, Thermal, and System teams (and Manufacturing) to ensure robust (and scalable) interconnect architecture integration.

High-Speed Interconnect Technology

• Support high-speed interconnection technologies, including  (400G / 800G) interconnect solutions and future high-bandwidth AI infrastructure connectivity solutions.
• Evaluate and drive implementation readiness for emerging technologies such as PCIe Gen6/Gen7, UALink,NVLink, high-speed optical interconnects, and next-generation GPU cluster connectivity solutions.
• Drive technology readiness assessment and solution feasibility studies according to industry technology trends.
• Develop strategic supplier technology roadmaps aligned with future AI infrastructure interconnect technologies and deployment requirements.

NPI & Engineering Support

• Lead and drive interconnect implementation activities throughout all NPI phases from concept development through EVT/DVT/PVT and sustaining.
• Own cable and connector component’s part list management, and interconnect technical documentation.
• Conduct NUDD analysis, engineering trade-off studies, risk analysis, and design reviews for Interconnect solutions.
• Lead sample verification, prototype bring-up, debugging, issue resolution and second source introduction during development phases.

Supplier Development & Component Qualification

• Lead and develop strategic suppliers include technical engagement, capability assessment, and manufacturing readiness reviews.
• Define and execute qualification plans and reliability requirements for cable and connector components.
• Assess technical impact of PCN/PCR changes and define mitigation actions.

• Maintain interconnect qualification records, databases, and lifecycle documentation.
• Drive cost optimization, AVL strategy, and supply continuity planning.

Required Qualifications

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• 5+ years of experience in server, networking, storage, HPC, AI infrastructure, or high-speed interconnect engineering
• Strong knowledge of:
  • High-speed cable and connector architectures
  • Signal and power interconnect systems
  • Qualification and reliability validation methods
  • Rack-level and cluster-level interconnect solutions
• Experience working with ODM/OEM, EMS, and component suppliers.
• Strong cross-functional communication, technical problem-solving, and project execution skills.

Preferred Qualifications

• Experience supporting AI server, GPU server, HPC, networking, or data center platforms.
• Familiarity with high-speed interconnect technologies (400G/800G, optical interconnect, UALink, NVLink, PCIe Gen6/Gen7, and next-generation AI fabric connectivity).
• Experience in NPI lifecycle management and supplier qualification processes.
• Understanding of signal integrity, power delivery, and thermal considerations in AI infrastructure systems.
• Experience supporting and bring-up supplier’s manufacturing and development sites is a plus.